COMPLAS 2023
Home
About
Complas 2023
Conference Series
Organization
Chairmen
Scientific Committee
Supporting Organizations
Plenary Lecturers
Plenary Lectures Videos
NEW
Minisymposia
Invited Minisymposia
Call and Topics
Programme
Programme Overview
Day-by-day Schedule
Programme Search
Registration Fees
Practical information
Access to the Conference Venue
Registration
Secretariat desk timetable
Rooms Location
Presentations
Social Programme
Internet Connection
Submission
Submission Dates
Submission Instructions
Journal Publications
NEW
Metals Journal
Engineering Computations
Sponsors & Exhibitors
Social Events
Venue & Travel
Venue
Host City — Barcelona
Travel
Accommodation
Secretariat
Photo Gallery
NEW
Conference pictures
Gala Dinner pictures
Download Poster
COMPLAS COURSE 2023
TUm-200b
- CT200b - Advanced Material Models and Computational Material Design
Tue, 05/09/2023
11:30 - 13:30
A4 - 205
TUm-200b
Scheduled presentations:
Plastic deformation based FEM solver to study lithiation in Silicon anode using phase-field modeling
*
U. Hussain
(IIT Madras)
,
N. Swaminathan
(IIT Madras)
,
G. Phanikumar
(IIT Madras)
Constitutive Modelling of Hydrolytic Degradation in Polymers
*
Z. Pan
(Department of Engineering Science, University)
,
H. Chen
(Department of Engineering Science, University)
,
L. Brassart
(Department of Engineering Science, University)
Influence of process parameters on elasto-visco-plastic material properties in vat photopolymerization
*
I. Valizadeh
(Technical University of Darmstadt)
,
O. Weeger
(Technical University of Darmstadt)
A Constitutive Model for the Simulation of the Behaviour of Polymer Glasses Across a Wide Range of Conditions
*
G. Owen
(University of Nottingham)
,
D. De Focatiis
(University of Nottingham)
Viscoplastic Constitutive Model for Foam-like Materials
*
B. Sharma
(IIT Bombay)
,
A. Gogulapati
(IIT Bombay)
,
A. Ramabathiran
(IIT Bombay)
,
V. Menezes
(IIT Bombay)
Modelling of Rate-dependent and Volumetric Inelasticity of Semi-crystalline Polymers Using an Eulerian Framework
*
M. Kroon
(Linnaeus University)
,
M. Rubin
(Technion Israel Institute of Technology)
Home
About
Complas 2023
Conference Series
Organization
Chairmen
Scientific Committee
Supporting Organizations
Plenary Lecturers
Plenary Lectures Videos
NEW
Minisymposia
Invited Minisymposia
Call and Topics
Programme
Programme Overview
Day-by-day Schedule
Programme Search
Registration Fees
Practical information
Access to the Conference Venue
Registration
Secretariat desk timetable
Rooms Location
Presentations
Social Programme
Internet Connection
Submission
Submission Dates
Submission Instructions
Journal Publications
NEW
Metals Journal
Engineering Computations
Sponsors & Exhibitors
Social Events
Venue & Travel
Venue
Host City — Barcelona
Travel
Accommodation
Secretariat
Photo Gallery
NEW
Conference pictures
Gala Dinner pictures
Download Poster
COMPLAS COURSE 2023